• Multi-layer PCB manufacturing (up to 8 Layers)
• Thickness of 0.8 to 3.2mm (with finished copper of 3oz for outer layers and 2oz for inner layers)
• Line width and spacing of 6/6mils (sample lots 5/5mils)
• Minimum finished hole size of 0.3mm
• Surface finish of Solder levelling / Lead free hot air levelling / Chemical Tin / Chemical Gold